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A literature review of smart warehouse operations management
Frontiers of Engineering Management 2022, Volume 9, Issue 1, Pages 31-55 doi: 10.1007/s42524-021-0178-9
Keywords: smart warehouse operations management interconnection automation integration sustainability
Optimal Su-Do-Ku based interconnection scheme for increased power output from PV array under partial
P. SRINIVASA RAO,P. DINESH,G. SARAVANA ILANGO,C. NAGAMANI
Frontiers in Energy 2015, Volume 9, Issue 2, Pages 199-210 doi: 10.1007/s11708-015-0350-1
Keywords: array configuration mismatch losses partial shading line losses Su-Do-Ku arrangement
Agent-Based Simulation for Interconnection-Scale Renewable Integration and Demand Response Studies Artical
David P. Chassin,Sahand Behboodi,Curran Crawford,Ned Djilali
Engineering 2015, Volume 1, Issue 4, Pages 422-435 doi: 10.15302/J-ENG-2015109
Keywords: interconnection studies demand response load control renewable integration agent-based simulation electricity
Exploration of interconnected factory mode: Haier Jiaozhou Air Conditioner Interconnected Factory
Yunjie ZHOU
Frontiers of Engineering Management 2017, Volume 4, Issue 4, Pages 500-503 doi: 10.15302/J-FEM-2017105
Keywords: interconnected factory mode user-centered mass customization interconnection
Creation and integration mechanism of instrumentation flexible developing system
Xiaoli XU, Qiushuang LIU
Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2, Pages 235-240 doi: 10.1007/s11465-011-0122-5
Keywords: modern instrumentation developing flexible interconnection flexible integration mechanism rapid integration
Heterogeneous III-V silicon photonic integration: components and characterization Special Feature on Optoelectronic Devices and Inte
Shang-jian ZHANG, Yong LIU, Rong-guo LU, Bao SUN, Lian-shan YAN
Frontiers of Information Technology & Electronic Engineering 2019, Volume 20, Issue 4, Pages 472-480 doi: 10.1631/FITEE.1800482
Heterogeneous III-V silicon (Si) photonic integration is considered one of the key methods for realizing power- and cost-effective optical interconnections, which are highly desired for future high-performance computers and datacenters. We review the recent progress in heterogeneous III-V/Si photonic integration, including transceiving devices and components. We also describe the progress in the on-wafer characterization of photonic integration circuits, especially on the heterogeneous III-V/Si platform.
Keywords: Heterogeneous photonic integration Optical interconnection On-wafer characterization
Ensuring Energy Security in China through International Energy Cooperation
Wang Jun, Cao Yang, Wang Yusheng, Rao Jianye
Strategic Study of CAE 2021, Volume 23, Issue 1, Pages 118-123 doi: 10.15302/J-SSCAE-2021.01.019
Keywords: international energy cooperation energy security oil and gas import power grid interconnection energy
On-chip optical interconnect using visible light Article
Wei CAI, Bing-cheng ZHU, Xu-min GAO, Yong-chao YANG, Jia-lei YUAN, Gui-xia ZHU, Yong-jin WANG, Peter GRÜNBERG
Frontiers of Information Technology & Electronic Engineering 2017, Volume 18, Issue 9, Pages 1288-1294 doi: 10.1631/FITEE.1601720
Keywords: Homogeneous integration Multiple-quantum-well diode Visible light interconnection Coexistence of light
Moving from exascale to zettascale computing: challenges and techniques None
Xiang-ke LIAO, Kai LU, Can-qun YANG, Jin-wen LI, Yuan YUAN, Ming-che LAI, Li-bo HUANG, Ping-jing LU, Jian-bin FANG, Jing REN, Jie SHEN
Frontiers of Information Technology & Electronic Engineering 2018, Volume 19, Issue 10, Pages 1236-1244 doi: 10.1631/FITEE.1800494
High-performance computing (HPC) is essential for both traditional and emerging scientific fields, enabling scientific activities to make progress. With the development of high-performance computing, it is foreseeable that exascale computing will be put into practice around 2020. As Moore’s law approaches its limit, high-performance computing will face severe challenges when moving from exascale to zettascale, making the next 10 years after 2020 a vital period to develop key HPC techniques. In this study, we discuss the challenges of enabling zettascale computing with respect to both hardware and software. We then present a perspective of future HPC technology evolution and revolution, leading to our main recommendations in support of zettascale computing in the coming future.
Keywords: High-performance computing Zettascale Micro-architectures Interconnection Storage system Manufacturing
Title Author Date Type Operation
Optimal Su-Do-Ku based interconnection scheme for increased power output from PV array under partial
P. SRINIVASA RAO,P. DINESH,G. SARAVANA ILANGO,C. NAGAMANI
Journal Article
Agent-Based Simulation for Interconnection-Scale Renewable Integration and Demand Response Studies
David P. Chassin,Sahand Behboodi,Curran Crawford,Ned Djilali
Journal Article
Exploration of interconnected factory mode: Haier Jiaozhou Air Conditioner Interconnected Factory
Yunjie ZHOU
Journal Article
Creation and integration mechanism of instrumentation flexible developing system
Xiaoli XU, Qiushuang LIU
Journal Article
Heterogeneous III-V silicon photonic integration: components and characterization
Shang-jian ZHANG, Yong LIU, Rong-guo LU, Bao SUN, Lian-shan YAN
Journal Article
Ensuring Energy Security in China through International Energy Cooperation
Wang Jun, Cao Yang, Wang Yusheng, Rao Jianye
Journal Article
On-chip optical interconnect using visible light
Wei CAI, Bing-cheng ZHU, Xu-min GAO, Yong-chao YANG, Jia-lei YUAN, Gui-xia ZHU, Yong-jin WANG, Peter GRÜNBERG
Journal Article